TSMC Boosts U.S. Investment to $165 Billion: Plans Three New Fabs and Two Advanced Packaging Facilities!

On March 3, local time in the United States, Wei Zhejia, chairman of TSMC, a leading wafer foundry, and US President Trump jointly announced that TSMC will intend to increase its investment of $100 billion in advanced semiconductor manufacturing in the United States. TSMC's total investment in the U.S. is expected to reach $165 billion, building on TSMC's ongoing $65 billion investment in advanced semiconductor manufacturing in Phoenix, Arizona.

TSMC's expanded $100 billion investment in the U.S. includes the construction of three new fabs, two advanced packaging facilities, and a major R&D team center, making it the largest single foreign direct investment in U.S. history.

With this expanded investment, TSMC expects to create hundreds of billions of dollars in semiconductor value in the U.S. for artificial intelligence (AI) and other forward-looking applications. The expansion is also expected to support approximately 40,000 construction jobs in the U.S. over the next four years and create tens of thousands of high-paying, high-tech jobs in advanced chip manufacturing and R&D. This investment is also expected to drive more than $200 billion in indirect economic output in Arizona and across the U.S. over the next decade.